The Knight Campus Cleanroom is a research fabrication facility for micro and nano-scale processing currently focused on neuro implant compatible material. The facility is open to university researchers and industry PIs seeking to fabricate novel materials for applications in bioengineering, advanced semiconductors, battery technology, or high-speed electronics. We can easily accommodate a wide range of substrates up to 150mm and are continuing to expand capabilities in various areas, for example: utilizing a dual frequency PECVD enabling low stress deposition of Silicon based films of SiO2, SiN and SiC or with our 6- Magnetron sputter chamber equipped with RF, DC or HIPIMS power supplies and unique reactive gases.
Knight Campus Cleanroom Instruments
Lithography |
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Photoresists and Lithography Chemicals : See stocked chemicals and datasheets |
Contact Aligners : SUSS MA/BA-6 |
Direct-Write Lithography : Maskless Heidelberg MLA150 |
E-Beam Lithography: ThermoFisher Scientific Apreo 2 SEM |
Dry Etch |
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Plasma Etching and Cleaning: Anatech SCE-108 |
Deep Silicon Etch: Plasma-Therm DSEIII |
Corial 210-IL |
Vacuum Deposition |
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Chemical Vapor Deposition (CVD): PlasmaTherm Versaline PECVD |
Thermal/Ebeam Evaporation: AJA ATC-2036-E |
Sputter Deposition: AJA Orion-8 |
Wet Processing |
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Solvent Cleaning Bench |
Spin coat Bench |
Toxic Corrosive Benches |
Spin Rinse Dryer |
Thermal Process |
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HMDS Prime Oven (YES) |
Inert N2 purge oven (Yamato) |
Packaging |
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Dicing Saw (ADT) |
Metrology |
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Optical Microscopes, SEM (ThermoFisher Apreo 2), Confocal (Keyence) |
Topographical Metrology: Step Profilometer (KLA Tencor P-7), Film Stress (Tencor Flexus) |
Thickness + Optical Constants: Optical Film Thickness (Microscope-Mounted Filmetrics F-40-UV) |
Knight Campus Cleanroom Documents
Knight Campus Cleanroom Contact Information
Sean Harris Cleanroom Engineer, 541.346.4534, cleanroom@uoregon.edu